Green Masking Tapes
also known as Powder Coating Masking Tapes,
are made of 2 mil thick polyester film with
1.5 mil thick silicone adhesive. They can
withstand temperatures of up to 400°F/(204°C).
Green Masking Tapes are extremely economical
and can be removed cleanly without leaving
any adhesive residue.
They are packaged in a 72 yard long roll
with a 3″ core.

Anodizing,Electronic Assembly,General Purpose Masking,Masking electronic components,Powder Coating,
Plating,Photo Splicing,Shipping and Packaging,Safety glazing,

Peter Lin,,
Whatsapp: 0086 15013829504,
WeChat: Wecan365

Green High Temperature Polyester Film Thermal Insulation Silicone Adhesive Masking tape

1.) Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint free wipe or swab should be adequate for removing surface contamination such as dust or finger prints. Do not use “denatured alcohol” or glass cleaners which often contain oily components. Allow the surface to dry for several minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketene (MEK) or toluene) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.

Note: Be sure to read and follow the manufacturers’ precautions and directions when using primers and solvents.

2.) Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to help reduce the potential for air entrapment under the tape during its application. The liner can be removed after positioning the tape onto the first substrate.

3.) Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon design of the parts. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. Use of a thicker tape may result in increased wetting of rigid substrates. Flexible substrates can be bonded to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrates can conform to the other substrates.